The semiconductor industry is currently one of the fastest growing industries in the world, widely used in aviation, aerospace, medical, automotive, electronics and other fields. Semiconductor packaging plays a vital role in the development of the semiconductor industry. Today, the battery cap manufacturing company Zhongao Xinci shares semiconductor device manufacturing packaging materials and production process flow with you.
1. What is a semiconductor device?
Semiconductor is a material with conductivity between metal conductors and insulators. Electronic devices with specific functions made of semiconductor materials are called semiconductor devices. Most semiconductor devices include at least one PN junction formed by the contact between the P-type semiconductor region and the N-type semiconductor region. The characteristics and working process of the semiconductor device are closely related to this.
2. What are the common semiconductor devices?
We generally divide common semiconductors into four categories, as shown in the following figure, which mainly include: integrated circuits, discrete devices, sensors and optoelectronic devices.
Common semiconductor device classification (as shown in the figure above)
Discrete devices are unpackaged and integrated independent devices, such as TO-seat cap packaged diodes, triodes, rectifier diodes and power diodes, etc., using certain wiring and manufacturing processes to integrate the discrete devices on the substrate and make the circuit we call it It is an integrated circuit, which can be divided into analog circuits, microprocessors, logic circuits, memory, etc. according to the circuit function and structure. Sensors are used everywhere. Our common sensors include atmospheric monitoring sensors, smoke sensors in corridors, and temperature sensors inside cars. According to their application methods and principles, they can be divided into physical sensors, chemical sensors and biological sensors; optoelectronic devices mainly include Optical devices, light-receiving devices and optical composite devices, such as our common LEDs and OLEDs, optical fibers and some laser transmitters, are all optoelectronic devices.
Three, new semiconductor device packaging materials and classification
There are three main types of common new semiconductor device packaging materials:
One is ceramic-based packaging materials, which have the advantages of high mechanical strength, thermal stability, good air tightness and moisture resistance, and a strong protection for electronic systems. The disadvantage is that they are high in cost and are suitable for the packaging of advanced microelectronic devices.
The second is plastic-based packaging materials. The advantages are low material cost, simple process, small size, and light weight. The disadvantages are high dielectric loss, high brittleness, mismatched thermal expansion coefficient and low thermal conductivity.
The third is metal-based packaging materials. The advantages are high thermal conductivity and strength, but the disadvantage is that the cost is high and it is not suitable for large-scale industrialization.
Fourth, the production process of semiconductor devices
The production process of semiconductor devices has four main parts, namely wafer manufacturing, wafer testing, chip packaging and post-package testing.
Wafer manufacturing refers to the production of circuits and electronic components such as transistors, capacitors, logic gates, etc. on silicon wafers. The entire process is complex, mainly including wafer cleaning, thermal oxidation, and photolithography (gluing, exposure, development) , Etching, ion implantation, diffusion, deposition and mechanical grinding steps to complete the processing and production of the circuit on the wafer.
Wafer testing refers to wafer acceptance testing of the electrical characteristics of the processed wafer. The purpose is to monitor the yield of the previous process and reduce production costs.
Chip packaging is the use of ceramic or plastic packaging die and wiring to form an integrated circuit; it plays a role of fixing, sealing and protecting the circuit.
Post-package testing is to perform performance testing on packaged chips to ensure the quality and performance of the device after packaging.
Five, content summary
The above is the question about the "semiconductor device manufacturing packaging materials and production process" that I shared for you.
